Work

Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features

Year: 2001

Type: article

Source: Journal of Applied Electrochemistry

DOI: 10.1023/a:1013872107905

Authors: W.H. Li, J.H. Ye, S.F.Y. Li

Institutions: Institute of Materials Research and Engineering, National University of Singapore

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2003269425

FWCI: 2.675

Cites: 6

Cited by: 186

Related to: 10