Work

Wafer level packaging of MEMS

Year: 2008

Type: article

Source: Journal of Micromechanics and Microengineering

DOI: 10.1088/0960-1317/18/7/073001

Author: Masayoshi Esashi

Institutions: Tohoku University, Advanced Institute for Materials Research, Tohoku University

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2003766830

FWCI: 20.12

Cites: 62

Cited by: 377

Related to: 10