Work

Dimensional and Locational Integrity in the Replication of Polymeric Microdevices

Year: 2007

Type: conference-paper

Source: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI: 10.1115/ipack2007-33482

Authors: Byoung Hee You, Daniel S. Park, Ping-Chuan Chen, Wilfredo M. Caceres, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy

Institution: Louisiana State University

Language: English

Topic: Injection Molding Process and Properties

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2004359504

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