Work

Analysis of the size effect in electroplated fine copper wires and a realistic assessment to model copper resistivity

Year: 2007

Type: article

Source: Journal of Applied Physics

DOI: 10.1063/1.2711385

Authors: W. Zhang, S. H. Brongersma, Z. Li, D. Li, O. Richard, K. Maex

Institutions: IMEC, KU Leuven

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2005871158

FWCI: 3.863

Cites: 17

Cited by: 93

Related to: 10