Work

Electromigration—A brief survey and some recent results

Year: 1969

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/t-ed.1969.16754

Author: J.R. Black

Institution: Motorola (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2007719944

FWCI: 11.06

Cites: 15

Cited by: 1,524

Related to: 10