Year: 2004
Type: article
Abstract: Extreme ultraviolet interference lithography (EUV-IL) was employed to fabricate large area stamps with patterns of sub-50nm half pitch for nanoimprint lithography (NIL). The resist patterns exposed by EUV-IL were transferred into underlying Si or SiO2∕Si substrates by reactive ion etching. With this method, NIL stamps with feature sizes as small as 25nm and patterned areas as large as 1×1mm2 were successfully produced. Using those stamps in NIL, the patterns with aspect ratio up to 2 were replicated with good replication fidelity. Increasing aspect ratio for the stamp patterns first results in distortion and discontinuity and then, the ripping of partial structures in the imprinted patterns.
DOI: 10.1116/1.1828087
Institution: Paul Scherrer Institute
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
Funder: Paul Scherrer Institut
OpenAlex ID: W2007844466
