VLSI design in the 3rd dimension
Year: 1998
Type: article
Source: Integration
Authors: Stephen Strickland, Erhan Ergin, David R. Kaeli, Paul Zavracky
Institution: Northeastern University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2008199403