Liquid Cooled Cold Plates for Industrial High-Power Electronic Devices—Thermal Design and Manufacturing Considerations
Year: 2009
Type: article
Source: Heat Transfer Engineering
Authors: Satish G. Kandlikar, Clifford N. Hayner
Institution: Rochester Institute of Technology
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2011185074
