Work

Self Patterned Gold Electroplating for High-Aspect-Ratio MEMS Structures

Year: 2010

Type: conference-paper

Abstract: This paper reports on a method for self-patterned pulse electroplating to selectively deposit gold on vertical surfaces of microfabricated silicon channels with a width of 30µm, a height of 250µm and spacing of 30µm. The electric field was simulated inside the channels. The results show that gold could be deposited only on vertical sidewalls of these structures.

Source: ECS Transactions

DOI: 10.1149/1.3484134

Authors: Hosein Zareie, Masoud Agah

Institution: Virginia Tech

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: bronze

Funders: National Science Foundation, Division of Chemical, Bioengineering, Environmental, and Transport Systems

Award: GOALI: MEMS-Based Preconcentrators with Nano-Structured Adsorbents for Micro Gas Chromatography