Work

Assembly Tolerance Analysis for Injection Molded Modular, Polymer Microfluidic Devices

Year: 2008

Type: conference-paper

Source: ASME International Mechanical Engineering Congress and Exposition (IMECE)

DOI: 10.1115/imece2008-68143

Authors: Byoung Hee You, Daniel S. Park, P.-C. Chen, Sudheer D. Rani, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy

Institution: Louisiana State University

Language: English

Topic: Manufacturing Process and Optimization

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2016686183

FWCI:

Cites:

Cited by: 1

Related to: 10