Work

Studies of the Ti-W/Au metallization on aluminum

Year: 1978

Type: article

Source: Thin Solid Films

DOI: 10.1016/0040-6090(78)90035-4

Authors: R.S. Nowicki, J.M. Harris, M.-A. Nicolet, I.V. Mitchell

Institutions: Intel (United States), Sandia National Laboratories, California Institute of Technology, Atomic Energy (Canada)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2017425396

FWCI: 3.327

Cites: 15

Cited by: 79

Related to: 10