Year: 2010
Type: article
Abstract: We have proposed and demonstrated an embedded thin film thermoelectric cooler attached between die chip and metal plate for Chip-on-Board (COB) direct assembly. The proposed structure of COB cooler was modeled by electrical equivalent circuit for SPICE simulation including operational heat generation of chip and PWM control of input power supply. The optimum input power of the TEC to achieve maximum temperature difference between chip and heat sink was simulated by using the proposed equivalent circuit. The measured and simulated results offer the possibility of thin film active cooling for COB direct assembly.
Source: IEICE Electronics Express
DOI: 10.1587/elex.7.1615
Authors: Shiho Kim, Hyunju Lee, Namjae Kim, Jungho Yoo
Institution: Chungbuk National University
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: bronze
Award: G2522869362
OpenAlex ID: W2019053000