Work

Characteristic study of chip-on-film interconnection

Year: 2000

Type: conference-paper

Source: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI: 10.1117/12.389412

Authors: Shyh-Ming Chang, JwoHuei Jou, Adam Hsieh, TaiHong Chen, ChingYun Chang, YungHao Wang, HongYu Lin, Chun M. Huang

Institutions: National Tsing Hua University, Industrial Technology Research Institute, Wintek (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2023986221

FWCI: 1.911

Cites: 2

Cited by: 3

Related to: 10