Work

Damascene copper electroplating for chip interconnections

Year: 1998

Type: article

Source: IBM Journal of Research and Development

DOI: 10.1147/rd.425.0567

Authors: P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, H. Deligianni

Institutions: IBM Research - Thomas J. Watson Research Center, IBM (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2027228089

FWCI: 18.3

Cites: 9

Cited by: 1,237

Related to: 10