Work

Delamination study of chip-to-chip bonding for a LIGA-based safety and arming system

Year: 1999

Type: conference-paper

Source: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI: 10.1117/12.359360

Authors: Gowrishankar Subramanian, Michael Deeds, Kevin R. Cochran, Raghu Raghavan, Peter A. Sandborn

Institutions: University of Maryland, College Park, Naval Surface Warfare Center

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2027864383

FWCI: 4.837

Cites:

Cited by: 8

Related to: 10