Work

Increasing the bonding strength of chips on flex substrates using thermosonic flip-chip bonding process with nonconductive paste

Year: 2009

Type: article

Source: Microelectronic Engineering

DOI: 10.1016/j.mee.2009.08.027

Authors: Cheng-Li Chuang, Qing-An Liao, Hsun-Tien Li, Shi-Jie Liao, Guo-Shing Huang

Institutions: Chung Shan Medical University Hospital, Chung Shan Medical University, National Chung Cheng University, Industrial Technology Research Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Science Council, Industrial Technology Research Institute

OpenAlex ID: W2029415494

FWCI: 1.557

Cites: 7

Cited by: 20

Related to: 10