Work

Tin–lead (SnPb) solder reaction in flip chip technology

Year: 2001

Type: article

Source: Materials Science and Engineering R Reports

DOI: 10.1016/s0927-796x(01)00029-8

Authors: K.N Tu, K Zeng

Institution: University of California, Los Angeles

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2030957321

FWCI: 24.06

Cites: 97

Cited by: 599

Related to: 10