Work

A Mathematical Model Predicting Heat Transfer Performance in a Oscillating Heat Pipe

Year: 2007

Type: conference-paper

Source: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

DOI: 10.1115/ipack2007-33246

Authors: H. B. Ma, B. Borgmeyer, P. Cheng, Y. Zhang

Institution: University of Missouri

Language: English

Topic: Heat Transfer and Boiling Studies

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2033350273

FWCI:

Cites: 10

Cited by: 1

Related to: 10