Wafer bonding for 3D integration of MEMS/CMOS
Year: 2006
Type: conference-paper
DOI: 10.1117/12.646467
Authors: Alison Gracias, James Castracane, Bai Xu
Institution: University at Albany, State University of New York
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2040600753