Adhesive wafer bonding
Year: 2006
Type: article
Source: Journal of Applied Physics
DOI: 10.1063/1.2168512
Authors: F. Niklaus, G. Stemme, J. -Q. Lu, R. J. Gutmann
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2040946508