Work

Vacuum packaging for microsensors by glass-silicon anodic bonding

Year: 1994

Type: article

Source: Sensors and Actuators A Physical

DOI: 10.1016/0924-4247(94)80003-0

Authors: H. Henmi, S. Shoji, Y. Shoji, K. Yoshimi, M. Esashi

Institution: Tohoku University

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2040987087

FWCI: 6.231

Cites: 3

Cited by: 231

Related to: 10