Work

Interdiffusion and reaction in bimetallic Cu-Sn thin films

Year: 1973

Type: article

Source: Acta Metallurgica

DOI: 10.1016/0001-6160(73)90190-9

Author: K.N Tu

Institution: IBM Research - Thomas J. Watson Research Center

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2042028632

FWCI: 5.332

Cites: 19

Cited by: 489

Related to: 10