Reliability study of wafer bonding for micro-electro-mechanical systems
Year: 2004
Type: conference-paper
DOI: 10.1117/12.524934
Authors: Mahmoud Almasri, Bruce Altemus, Alison Gracias, Larry Clow, Natalya Tokranova, James Castracane, Bai Xu
Institution: University at Albany, State University of New York
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2044691143