Work

Engineered thermal interface material

Year: 2014

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2014.6897294

Authors: Lyndon Larson, Yin Tang, Loren Durfee, Cassandra Hale, David Plante, Sushumna Iruvanti, Rebecca Wagner, Taryn Davis, Hai Longworth, Annique Lavoie, Richard Langois

Institutions: IBM (United States), IBM (Canada)

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2047393609

FWCI: 5.558

Cites: 4

Cited by: 11

Related to: 10