Work

Characterization of Intermetallic Compounds in Al-Cu-Bimetallic Interfaces

Year: 2012

Type: conference-paper

Source: IEEE Holm Conference on Electrical Contacts (HOLM)

DOI: 10.1109/holm.2012.6336554

Authors: S. Pfeifer, S. Großmann, R. Freudenberger, H. Willing, H. Kappl

Institutions: Institute of Electrical Power Systems and High Voltage Engineering, Technische Universität Dresden, Forschungsinstitut für Edelmetalle und Metallchemie

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2050191207

FWCI: 1.621

Cites: 15

Cited by: 33

Related to: 10