Work

Low-temperature low-pressure die attach with hybrid silver particle paste

Year: 2011

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2011.07.088

Authors: K. Suganuma, S. Sakamoto, N. Kagami, D. Wakuda, K.-S. Kim, M. Nogi

Institutions: The Institute of Scientific and Industrial Research, The University of Osaka, The University of Osaka

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Japan Society for the Promotion of Science

Award: Science of Hetero-Interface of Advanced Power Devises in Extreme Environments

OpenAlex ID: W2050870760

FWCI: 5.293

Cites: 22

Cited by: 288

Related to: 10