Work

Resonant pressure sensor with on-chip temperature and strain sensors for error correction

Year: 2013

Type: conference-paper

Source: IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

DOI: 10.1109/memsys.2013.6474172

Authors: Chia-Fang Chiang, Andrew B. Graham, Brian J. Lee, Chae Hyuck Ahn, Eldwin J. Ng, Gary J. O'Brien, Thomas W. Kenny

Institutions: Stanford University, Robert Bosch (United States)

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Robert Bosch

OpenAlex ID: W2055879981

FWCI: 3.649

Cites: 9

Cited by: 30

Related to: 10