Work

Effects of PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect

Year: 1999

Type: conference-paper

Source: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI: 10.1117/12.346918

Authors: YongTae Kim, Dong J. Kim, Seoghyeong Lee, Young K. Park, Ik-Soo Kim, Jong-Wan Park

Institutions: Korea Institute of Science and Technology, Hanyang University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2057010072

FWCI:

Cites: 1

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Related to: 10