Work

Time-Accurate, 3-D Computation of Wire Sweep During Plastic Encapsulation of Electronic Components

Year: 2001

Type: article

Source: Journal of Pressure Vessel Technology

DOI: 10.1115/1.1401024

Authors: H.-Q. Yang, S. Bayyuk, S. Mazumder, S. Lowry, A. Krishnan, A. Przekwas, L. Nguyen

Institution: CFD Research Corporation (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Defense Advanced Research Projects Agency

OpenAlex ID: W2058522266

FWCI:

Cites: 9

Cited by: 16

Related to: 10