Work

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Year: 2002

Type: article

Source: Materials Science and Engineering R Reports

DOI: 10.1016/s0927-796x(02)00007-4

Authors: K. Zeng, K.N. Tu

Institution: University of California, Los Angeles

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2059523013

FWCI: 56.06

Cites: 104

Cited by: 1,370

Related to: 10