Fracture mechanics analysis on Smart-Cut® technology. Part 1: Effects of stiffening wafer and defect interaction
Work
Year: 2008
Type: article
Source: Acta Mechanica Sinica
Institutions The University of Sydney, Tsinghua University
Cites: 26
Cited by: 9
Related to: 10
FWCI: 1.11
Citation percentile (by year/subfield): 69.47
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed