Etchant Solutions for the Removal of Cu(0) in a Supercritical CO2-Based “Dry” Chemical Mechanical Planarization Process for Device Fabrication
Year: 2003
Type: article
DOI: 10.1021/ja034091m
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2061128152
