Year: 2003
Type: article
Abstract: A one-step process for copper nanopatterning on a silicon surface is reported. The patterns were formed by selective copper electroless deposition from a diluted solution on defect sites on the silicon surfaces introduced by nanomechanical scratching. Field emission scanning electron microscopy and energy dispersive X-ray spectroscopy analyses show that copper particles were deposited preferentially on well-defined defect sites with high selectivity. The experiment demonstrated here shows a new one-step approach for metallic nanopatterning formation on a silicon surface. © 2003 The Electrochemical Society. All rights reserved.
DOI: 10.1149/1.1592520
Authors: Jaeyoung Choi, Zhan Chen, Rajiv K. Singh
Institution: University of Florida
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W2061612323