Work

Analysis of the Electronic Assembly Repair Process for Lead-Free Parts Under Combined Loading Conditions

Year: 2012

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2012.2207958

Authors: Anthony Konoza, Peter A. Sandborn, Andrew C. Chaloupka

Institution: University of Maryland, College Park

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2062534695

FWCI:

Cites: 11

Cited by: 3

Related to: 10