Work

A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices

Year: 2010

Type: article

Source: Metallurgical and Materials Transactions B

DOI: 10.1007/s11663-010-9365-5

Authors: Hui Shun Chin, Kuan Yew Cheong, Ahmad Badri Ismail

Institution: Universiti Sains Malaysia

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2064911795

FWCI: 7.865

Cites: 49

Cited by: 340

Related to: 10