Conformal contact and pattern stability of stamps used for soft lithography
Year: 2000
Type: article
Source: Journal of Applied Physics
DOI: 10.1063/1.1289816
Authors: Alexander Bietsch, Bruno Michel
Institution: IBM Research - Zurich
Language: English
Subfield: Surfaces, Coatings and Films
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2067020292
