Work

Metal–metal bonding process using Ag metallo-organic nanoparticles

Year: 2005

Type: article

Source: Acta Materialia

DOI: 10.1016/j.actamat.2005.01.047

Authors: E. Ide, S. Angata, A. Hirose, K.F. Kobayashi

Institution: The University of Osaka

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Ministry of Education, Culture, Sports, Science and Technology, Japan Society for the Promotion of Science

OpenAlex ID: W2069670770

FWCI: 6.967

Cites: 20

Cited by: 502

Related to: 10