Work

Preparation of Thin Cu Electrode on Al2O3 + Clay Substrate by Pulsed DC Magnetron Sputtering

Year: 2013
Type: article
Abstract: Aluminum oxide (Al2O3) and Copper (Cu) are popular into insulator and electrode for thermoelectric module. The Al2O3 + clay substrate was prepared by solid state reaction and the thin Cu electrode prepared by pulsed DC magnetron sputtering. Crystal structure and microstructure of the substrate were measured by using the X-ray diffraction and scanning electron microscopy techniques. The Vicker hardness and density were measured by Micro Hardness tester and Archimedes method, respectively. The X-ray diffraction patterns of the substrate were obtained mix phases such as Al2O3, clay and Cu phases. The hardness and density were obtained mean value of 332.11 HV and 2.47 g/cm3.
Language: English
Open Access status: hybrid
OpenAlex ID: W2070181637
FWCI:
Cites: 12
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Related to: 10