Preparation of Thin Cu Electrode on Al2O3 + Clay Substrate by Pulsed DC Magnetron Sputtering
Year: 2013
Type: article
Abstract: Aluminum oxide (Al2O3) and Copper (Cu) are popular into insulator and electrode for thermoelectric module. The Al2O3 + clay substrate was prepared by solid state reaction and the thin Cu electrode prepared by pulsed DC magnetron sputtering. Crystal structure and microstructure of the substrate were measured by using the X-ray diffraction and scanning electron microscopy techniques. The Vicker hardness and density were measured by Micro Hardness tester and Archimedes method, respectively. The X-ray diffraction patterns of the substrate were obtained mix phases such as Al2O3, clay and Cu phases. The hardness and density were obtained mean value of 332.11 HV and 2.47 g/cm3.
Source: Advanced materials research
Authors: Nuansiri Chansimuang, Tosawat Seetawan
Institution: Sakon Nakhon Rajabhat University
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W2070181637
