Work

Low dielectric constant films prepared by plasma-enhanced chemical vapor deposition from tetramethylsilane

Year: 1999

Type: article

Source: Journal of Applied Physics

DOI: 10.1063/1.369677

Authors: A. Grill, V. Patel

Institution: IBM Research - Thomas J. Watson Research Center

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2071606652

FWCI: 7.739

Cites: 8

Cited by: 173

Related to: 10