Work

Recent advances on electromigration in very-large-scale-integration of interconnects

Year: 2003

Type: article

Source: Journal of Applied Physics

DOI: 10.1063/1.1611263

Author: K. N. Tu

Institution: University of California, Los Angeles

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2073439750

FWCI: 26.96

Cites: 70

Cited by: 1,078

Related to: 10