Fabrication of hall device structures in 3C-SiC using microelectromechanical processing technology
Year: 2006
Type: article
Source: Microelectronic Engineering
Authors: L. Jiang, S. Anderson, E. Thong, R. Cheung, C.A. Zorman, M. Mehregany
Institutions: University of Edinburgh, Case Western Reserve University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2074553145