Work

Kinetic model for dependence of thin film stress on growth rate, temperature, and microstructure

Year: 2012

Type: article

Source: Journal of Applied Physics

DOI: 10.1063/1.4704683

Authors: E. Chason, J. W. Shin, S. J. Hearne, L. B. Freund

Institutions: University of Illinois Urbana-Champaign, Brown University, Sandia National Laboratories

Language: English

Topic: Metal and Thin Film Mechanics

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: U.S. Department of Energy, National Nuclear Security Administration, Lawrence Livermore National Laboratory, Sandia National Laboratories

OpenAlex ID: W2076138392

FWCI: 9.603

Cites: 29

Cited by: 135

Related to: 10