Work

Studies on CO[sub 2]-Based Slurries and Fluorinated Silica and Alumina Particles for Chemical Mechanical Polishing of Copper Films

Year: 2006

Type: article

Source: Journal of The Electrochemical Society

DOI: 10.1149/1.2358085

Authors: Pamela M. Visintin, Sean K. Eichenlaub, Lauren E. Portnow, Ruben G. Carbonell, Stephen P. Beaudoin, Cynthia K. Schauer, Joseph M. DeSimone

Institutions: University of North Carolina at Chapel Hill, North Carolina State University, Purdue University West Lafayette

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Science Foundation, Purdue University, North Carolina State University

OpenAlex ID: W2081119806

FWCI:

Cites: 29

Cited by: 4

Related to: 10