Cure shrinkage analysis of epoxy molding compound
Year: 2001
Type: article
Source: Polymer Engineering and Science
DOI: 10.1002/pen.10837
Authors: Ken Oota, Masumi Saka
Institutions: Sumitomo Bakelite (Japan), Tohoku University
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2083766541