Work

Reliability Trends with Advanced CMOS Scaling and The Implications for Design

Year: 2007

Type: conference-paper

Source: IEEE Custom Integrated Circuits Conference (CICC)

DOI: 10.1109/cicc.2007.4405763

Author: J.W. McPherson

Institution: Texas Instruments (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2084379018

FWCI: 8.142

Cites: 13

Cited by: 56

Related to: 10