Work

Copper Metallization Layers on Bismuth-Telluride Substrates: Effectiveness of Cr, Pt, and Ta40Si14 N46 Thin Films as Diffusion Barriers

Year: 1998

Type: article

Source: MRS Proceedings

DOI: 10.1557/proc-514-537

Authors: T. Kacsich, M.-A. Nicolet, E. Kolawa, J.-P. Fleurial

Institutions: California Institute of Technology, Jet Propulsion Laboratory

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: bronze

OpenAlex ID: W2084784549

FWCI: 0.277

Cites:

Cited by: 1

Related to: 10