Work

Should good patents come in small packages? A welfare analysis of intellectual property bundling

Year: 2006

Type: article

Source: International Journal of Industrial Organization

DOI: 10.1016/j.ijindorg.2005.06.003

Authors: Richard J. Gilbert, Michael L. Katz

Institution: University of California, Berkeley

Language: English

Topic: Intellectual Property and Patents

Subfield: Management of Technology and Innovation

Field: Business, Management and Accounting

Domain: Social Sciences

SDG: Industry, innovation and infrastructure

Open Access status: green

OpenAlex ID: W2085867352

FWCI: 2.188

Cites: 28

Cited by: 15

Related to: 10