Work

FIB methodologies to analyze buried defects in wafer manufacture process

Year: 2014

Type: conference-paper

Source: IEEE International Conference on Solid-State and Integrated Circuit Technology

DOI: 10.1109/icsict.2014.7021521

Authors: Yaobin Zhao, Haibo Dai, J.H. Lee, Mark Zhang, May Yang, Kary Chian

Institution: Semiconductor Manufacturing International (China)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2086531644

FWCI:

Cites: 4

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Related to: 10