Work

System integration of the Utah electrode array using a biocompatible flip chip under bump metallization scheme

Year: 2007

Type: conference-paper

Source: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI: 10.1117/12.716102

Authors: Rajmohan Bhandari, Sandeep Negi, Loren Rieth, Michael Toepper, Sohee Kim, Matthias Klein, Hermann Oppermann, Richard A. Normann, Florian Solzbacher

Institutions: University of Utah, Fraunhofer Institute for Reliability and Microintegration

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2089406331

FWCI:

Cites:

Cited by: 1

Related to: 10