Study of Interfacial Moisture Diffusion at Cu/Epoxy Interface by FTIR-MIR Technique
Year: 2007
Type: conference-paper
Authors: Edward K L Chan, Matthew M F Yuen
Institution: Hong Kong University of Science and Technology
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2092838678